Brady Corporation Asia Pacific Pte Ltd – Firmware Engineer Intern

Company
Brady Corporation Asia Pacific Pte Ltd
bradycorp.com
Designation
Firmware Engineer Intern
Date Listed
28 Dec 2016
Job Type
Entry Level / Junior Executive
Intern/TS
Job Period
Immediate Start, For At Least 6 Months
Profession
Engineering
Industry
Location Name
Kaki Bukit Crescent
Allowance / Remuneration
$800 - 1,000 monthly
Company Profile

Brady Corporation is a $1.23 billion dollar international company headquartered in Milwaukee, WI, recognized as a global leader in engineered film and solution development for many industries including high performance labels, printing systems and highly engineered components for most sectors of the consumer electronics industry. Brady is also the world leader in delivering innovative solutions for safety & facility, wire & cable identification supporting the broader industrial sector.

Website

www.bradycorp.com 

Job Description

Job Scope:

  • Maintain the current automated test system using NI tools and custom scripting
  • Implement new automation scripts for new test cases.
  • Learn Team foundation Server (TFS) build automation tool.
  • Maintain and Enhance build automation
  • Assist Developers in running the automation tests


Requirements:

  • Degree / Diploma in microelectronics or related field
  • Basic knowledge in NI toolset
  • Basic knowledge in NI FPGA programming
This position is already closed and no longer available.  You may like to view the other latest internships here.

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