Technoform Edge Bond Solutions Singapore Pte Ltd – Intern – Process Engineer

Internship – Process Engineer

Company Name

Technoform Edge Bond Solutions Singapore Pte Ltd

Location

West Park BizCentral, 32 Pioneer Crescent

Essential Responsibilities

• Dive deep into understanding our manufacturing workflows and process steps to identify gaps and business challenges for business continuity and improvement planning.
• Benchmark with industry best practices internally within our global networks and externally with industry.
• Collaborating with multi-functional teams to identify issues and resolve issues.
• Develop and lead process improvement implementation plan.

• Working with the technical team in developing and leading process improvement implementation plan.

Qualification Requirements

• Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.
• Looking for a minimum of 3 months internship
• Ability to learn quickly in a rapidly changing environment
• Excellent organizational, analytical skills and attention to detail
• Superb communication skills

Working Hours

• Monday – Friday
• 8.30 a.m. – 5.30 p.m.

Character

• Possess a strong sense of responsibility
• Enjoy working in a fast pace environment
• Be a team player, with the open mindedness to work in teams of different culture
• Possess good interpersonal skills, able to communicate to all levels of staff effectively
• Aptitude for problem solving
• Ability to work independently
• Non-hierarchical

Salary Range

• $900-1000/month