Technoform Edge Bond Solutions Singapore Pte Ltd – Internship – Management Associate

Internship – Management Associate

Technoform Edge Bond Solutions Singapore Pte Ltd

Location West Park BizCentral, 32 Pioneer Crescent

Essential

Responsibilities

 Exposure to the different business functions such as logistics, quality, marketing, digitalization and business development.

 Explore, identify and implement improvement projects in different business functions to bring value add.

 Work on digitalization projects across different business units to drive for better efficiency.

Qualification

Requirements

 Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.

 Looking for a minimum of 3 months internship

 Ability to learn quickly in a rapidly changing environment

 Excellent organizational, analytical skills and attention to detail

 Superb communication skills

Working Hours

 Monday – Friday

 8.30 a.m. – 5.30 p.m.

Character

 Possess a strong sense of responsibility

 Enjoy working in a fast pace environment

 Be a team player, with the open mindedness to work in teams of different culture

 Possess good interpersonal skills, able to communicate to all levels of staff effectively

 Aptitude for problem solving

 Ability to work independently

 Non-hierarchical

Salary Range  $900-1000/month