Technoform Edge Bond Solutions Singapore Pte Ltd – Internship – Management Associate

Company
Technoform Edge Bond Solutions Singapore Pte Ltd
ap.technoform.com
Designation
Internship – Management Associate
Date Listed
01 Oct 2024
Job Type
Entry Level / Junior Executive
Full/Perm
Job Period
From Jan 2025, For At Least 4 Months
Profession
Engineering
Industry
Manufacturing General / Biomedical / Pharmaceutical
Location Name
Pioneer Crescent, Singapore
Address
Pioneer Cres, Singapore
Map
Allowance / Remuneration
$1,000 monthly
Company Profile

Technoform specializes in the extrusion of thermoplastic profiles. This specialization applies particularly to the manufacture and development of insulating profiles for aluminum windows, doors, and facades. 

Job Description

 Exposure to the different business functions such as logistics, quality, marketing, digitalization and business development.

 Explore, identify and implement improvement projects in different business functions to bring value add.

 Work on digitalization projects across different business units to drive for better efficiency.

 Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.

 Looking for a minimum of 3 months internship

 Ability to learn quickly in a rapidly changing environment

 Excellent organizational, analytical skills and attention to detail

 Superb communication skills

Application Instructions
Please apply for this position by submitting your text CV using InternSG.
Kindly note that only shortlisted candidates will be notified.

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