Technoform Edge Bond Solutions Singapore Pte Ltd – Internship – Process Engineer

Company
Technoform Edge Bond Solutions Singapore Pte Ltd
ap.technoform.com
Designation
Internship – Process Engineer
Date Listed
16 Sep 2024
Job Type
Entry Level / Junior Executive
Intern/TS
Job Period
From Jan 2025, For At Least 5 Months
Profession
Engineering
Industry
Precision Engineering
Location Name
Pioneer Crescent, Singapore
Address
Pioneer Cres, Singapore
Map
Allowance / Remuneration
$1,000 monthly
Company Profile

Technoform specializes in the extrusion of thermoplastic profiles. This specialization applies particularly to the manufacture and development of insulating profiles for aluminum windows, doors, and facades. 

Job Description
  • Dive deep into understanding our manufacturing workflows and process steps to identify gaps and business challenges for business continuity and improvement planning.
  • Benchmark with industry best practices internally within our global networks and externally with industry.
  • Collaborating with multi-functional teams to identify issues and resolve issues.
  • Develop and lead process improvement implementation plan.
  • Working with the technical team in developing and leading process improvement implementation plan.
  • Pursuing a Bachelors degree in Engineering or Science with an expected graduation date of December 2021 or later.
  • Looking for a minimum of 3 months internship
  • Ability to learn quickly in a rapidly changing environment
  • Excellent organizational, analytical skills and attention to detail
  • Superb communication skills
This position is already closed and no longer available.  You may like to view the other latest internships here.

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