Technoform Edge Bond Solutions Singapore Pte Ltd – Management Associate Intern

Company
Technoform Edge Bond Solutions Singapore Pte Ltd
ap.technoform.com
Designation
Management Associate Intern
Date Listed
10 Oct 2022
Job Type
Entry Level / Junior Executive
Intern/TS
Job Period
Immediate Start, For At Least 3 Months
Profession
Engineering
Industry
Precision Engineering
Location Name
Bizcentral, Technoform Edge Bond Solutions Singapore, Singapore
Address
32 Pioneer Crescent West Park, Bizcentral, #05-18/19, Singapore 628561
Map
Allowance / Remuneration
$900 - 1,000 monthly
Company Profile

Technoform is the market leader in multiple industries with innovative and market oriented solutions and is present with more than 45 factories and sales offices globally.  Our solutions are applied in industries that require the highest standards for precision and quality and these include aerospace, automotive, building and seawater desalination.   

In the building industry, we are a highly specialized and trusted partner to our stakeholders for more than 40 years. Our core solutions of high-precision thermal insulation profiles and edge bond technology help buildings achieve better energy and environmental balance. 

Our global team of passionate people connect with like-minded and forward looking organizations and together, we make the world better and more sustainable, one building façade at a time 

Job Description
  • Exposure to the different business functions such as logistics, quality, marketing, digitalization and business development.
  • Explore, identify and implement improvement projects in different business functions to bring value add.
  • Work on digitalization projects across different business units to drive for better efficiency.

 

This position is already closed and no longer available.  You may like to view the other latest internships here.

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