Company
Teckwah Industrial Corporation Pte Ltd
teckwah.com.sg
Designation
Software Developer / Engineer Intern
Date Listed
18 Dec 2024
Job Type
Entry Level / Junior Executive
Intern/TS
Job Period
Flexible Start, For At Least 3 Months
Profession
IT / Information Technology
Industry
Manufacturing Food / Lifestyle / Packaging
Location Name
Upper Paya Lebar Road, Tai Seng MRT Station (CC11), Singapore
Address
33 Upper Paya Lebar Rd, Singapore 534803
Map
Allowance / Remuneration
$800 - 1,200 monthly
Company Profile
Teckwah runs packaging printing manufacturing and logistics operations in Singapore and regional offices. We are currently undergoing a massive digitalization program to automate, transform and innovate our operations. This is an excellent opportunity for students to gain hands-on experience, implementing digitalization projects together with our staff.
Job Description
- Business Analysis: Participate in requirements gathering and translating them into software designs
- Software Development: Assist in the design, development, and testing of software applications.
- Code Review: Participate in code reviews to ensure code quality and adherence to best practices.
- Deployment: Provide support and rectify bugs for applications deployed.
- Documentation: Write and maintain technical documentation for software projects.
- Collaboration: Work closely with senior developers and other team members to understand project requirements and deliver solutions.
- Learning and Development
- Knowledge of Software Development Lifecycle: will undergo software development lifecycle and agile methodologies.
- Continuously learn and apply new programming skills and technologies.
Application Instructions
Please apply for this position by submitting your text CV using InternSG.
Kindly note that only shortlisted candidates will be notified.
Kindly note that only shortlisted candidates will be notified.
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